A Multi-Institutional Digital Twin and AI Educational Platform for Advanced Microelectronics Fabrication and Device Packaging Training
Kristal Hong, Ishan Jha, Abubaker Ahmadi, Peter Stout, G.P. Li, Bert Harrop, Alex Norman
Journal of Advanced Technological Education
Accepted Nov 2024
Abstract
Technology today is at a crossroads between Industry 4.0 and 5.0, where products and services are manufactured and designed to be βhuman-centeredβ and sustainable. Such objectives have always been expected in education, especially in the way the workforce is trained. Leveraging on prior research which was done by a team from Pasadena City College (PCC) and UC Irvine, we have formed a bi-coastal collaborative, including Mercer County Community College (MCCC) and Princeton University, to expand and transcend our earlier AI-powered virtual reality (VR) simulation framework and platform, AI-powered digital twin (DT/AI) for education. This Phase-2 effort demonstrates a working, multi-institution R&D platform with the following capabilities: (a) new training modules with enhanced lithography training and advanced device packaging, (b) better optimized, high-fidelity equipment emulations and process simulations that much closely replicate the physical equipment, (c) adherence to documented facility-specific Standard Operation Procedure (SOP) and manufacturing process flow, (d) a parallel fabricated chip-under-test and its test board for I/O connectivity verification, and last but not the least, (e) a tightly-coupled agentic AI engines available throughout the training session to customize learner-centric experiences to enhance individual knowledge acquisition and retention. The authors also continue to demonstrate the feasibility and scalability benefits of foundational VR/AR-based training for students, technicians, and up-skill learners for whom direct cleanroom or packaging lab access is often unattainable; while with DT/AI, learning and feedback is affordable and widely accessible.